технические характеристики

• Number of Channels: Mono
• Architecture: Class D
• Output Power typ: 2.1 W
• Amp Supply Voltage min: 2.6 V
• Amp Supply Voltage max: 5.5 V
• Temperature Range: -40 to 85°C
• Package: Wafer-Level Package 3x3 Bump, Full Array, Thin Dual Flatpack No Leads, Exposed Pad
• Package Area: 1.69mm² (Wafer-Level Package 3x3 Bump, Full Array) (MAX98300EWL+)
• Package Height: 0.69mm (Wafer-Level Package 3x3 Bump, Full Array) (MAX98300EWL+)
• Lifecycle: Production

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