технические характеристики

• Configuration: 2:1 DPDT
• Number of Channels: 8
• Charge Injection typ: 15 pC
• Bandwidth -3 dB: 150 MHz
• Single Supply Voltage Span min: 1.8 V
• Single Supply Voltage Span max: 5.5 V
• Package: LFCSP, Wafer-Level Package 6x6 Bump, Depopulated
• Package Area: 10.1124mm² (Wafer-Level Package 6x6 Bump, Depopulated) (MAX4760EWX+)
• Package Height: 0.69mm (Wafer-Level Package 6x6 Bump, Depopulated) (MAX4760EWX+)
• Lifecycle: Recommended For New Designs

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