технические характеристики

• Configuration: SPST
• Number of Channels: 16
• Switch RON typ: 15 Ω
• Charge Injection typ: 600 pC
• Bandwidth -3 dB: 20 MHz
• Channel On Capacitance typ: 36 pF
• Single Supply Voltage Span min: 40 V
• Single Supply Voltage Span max: 200 V
• Dual Supply Voltage Span min: 40 V
• Dual Supply Voltage Span max: 160 V
• Package: Wafer-Level Package 10x11 Bump, Full Array
• Package Area: 32.2263mm² (Wafer-Level Package 10x11 Bump, Full Array) (MAX14803AEWZ+)
• Package Height: 0.69mm (Wafer-Level Package 10x11 Bump, Full Array) (MAX14803AEWZ+)
• Lifecycle: Production

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